All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Energy and bandwidth efficient technology built to scale optical connectivity for AI-era data center interconnect.
Shaping the Foundation of Energy-Efficient AI
with Highly Integrated Photonics Connectivity Solutions
I/O Engine Chips Serving External and NPO Transceiver Pluggable Applications
Discover laser-integrated, low power flip-chip optical engines designed for scale-out and scale-up AI network infrastructure – from FRO/LRO DSP, LPO and XPO, to USFP and CPX form factors. NPG and NPC chip families support external pluggable and NPO socket modules across the range of speed and bandwidth demands in compact packaging.
NPC: Servicable & High-Density NPO
NPC505 laser-integrated PIC family supports NPO socket pluggable solutions at high bandwidth density and low power in a compact, serviceable solution.
NPG102 for DSP Optical Modules
Laser Integrated PIC family enabling high-volume FRO/LRO transceiver scale-out in the AI-era optical data center.
NPG Designs for DSP
The LPO+™ Advantage: All-Optics Signal Processing
LPO Plus advanced OSPic® all-optical signal processing delivers interoperability for highly efficient all-optical interconnect.
LPO+ SolutionsBreakthrough Connectivity Platform for AI Interconnect
Our innovative co-packaged optics (CPO) chiplets feature a highly integrated optical engine for energy efficient and high density bandwidth in hyperscaler, neo-cloud and data center AI fabrics.
High Density 3.2T 400G PIC
Compact, highly integrated 3.2T engine optimized for pluggable and high-density NPO architectures.
Get 3.2T 448G
Heaterless High Density CPO
Discover breakthrough power-efficient MRM optical engine technology for CPO with Syncra™ heaterless micro-ring modulator (MRM) enabled by Niox™ zero loss monitoring and real-time calibration.
Go Heaterless
Current Insights from NewPhotonics
Check back here for the most recent news and upcoming events where you’ll find TeamNP!
Is This the End of the AI Open Frontier?
Why inference and scale-up networking, not model access, is the next battleground for deployed AI…
Newsmakers: Advanced Photonics Integration and HVM with Gemtek Technology
Gemtek announces HVM transceiver collaboration for the AiPhoton 1.6T OSFP module featuring NewPhotonics laser integrated…
HVM Advantage: Adopting yieldHUB Analytics Platform to Drive PIC Quality and Reliability
This week yieldHUB, the industry’s leader in advanced yield management and semiconductor analytics solutions, announced…
Join The All-Optical Team
Meet the leaders of #TeamNP and join our award winning group of all-optical innovators at the forefront of AI-era interconnect.