All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for power and bandwidth efficient optical connectivity in the AI-scale data center.
Shaping the Foundation of Energy-Efficient AI
with Highly Integrated Photonics Connectivity Solutions
Optical Signal Processing for Pluggables and Co-Packaged Optics
Discover advanced silicon photonic integrated circuit (PIC) chips designed for scale-out and scale-up data center infrastructure. Migrate to the power-saving advantage at 1.6T, 3.2T and beyond.
The DSP Optical Module
Laser Integrated PICs simplify volume production and reliability for optics in DSP interconnect scale-out.
DSP Designs
The LPO+™ OSP Advantage
LPO plus optical signal processing (OSP) delivers interoperability for highly efficient all-optical interconnect.
LPO+ Solutions
Breakthrough Optical Connectivity for Scale CPO
Our innovative co-packaged optics (CPO) chiplets feature a highly integrated optical engine for energy and bandwidth efficiency in scale-up and scale-out interconnect.
Serviceable NPO with Interop
Compact 1.6T NPC50503 PIC – a chiplet solution for pragmatic, serviceable NPO with integrated lasers and SmartPIC programmable photonic toolset.
Path to NPO
Heaterless High Density CPO
Discover new breakthrough power-efficient optical engine technology for CPO with our innovative Syncra™ heaterless micro-ring modulator (MRM) enabled by Niox™ zero loss monitoring and real-time calibration.
Go Heaterless
Current Insights from NewPhotonics
Check back here for the most recent news and upcoming event info on NewPhotonics!
HVM Advantage: Adopting yieldHUB Analytics Platform to Drive PIC Quality and Reliability
This week yieldHUB, the industry’s leader in advanced yield management and semiconductor analytics solutions, announced…
We Broke the CPO Thermal Barrier: Introducing Syncra™ Heaterless Micro-Ring Modulator
The hyperscaler data center industry is in a race against continuous and massive AI adoption…
Next Gen Scaling in the AI Factory: Introducing the Industry-First 3.2T 400G Transmitter-on-Chip
The AI Factory is no longer a conceptual blueprint; it is the current reality of…
Join The All-Optical Team
Meet the leaders of #TeamNP and join our award winning group of all-optical innovators at the forefront of AI-era interconnect.
All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for energy and bandwidth efficient optical connectivity in the AI-scale data center.
All-Optical Photonic IC Designed for Scale
Highly integrated Photonic IC chip solutions.
Designed for pluggables and co-packaged optics.
Built for energy and bandwidth efficient optical
connectivity in the AI-scale data center.