All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for energy and bandwidth efficient optical connectivity in the AI-scale data center.
All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for power and bandwidth efficient optical connectivity in the AI-scale data center.
All-Optical Photonic IC Designed for Scale
Highly integrated Photonic IC chip solutions.
Designed for pluggables and co-packaged optics.
Built for energy and bandwidth efficient optical
connectivity in the AI-scale data center.
Shaping the Foundation of Energy-Efficient AI
with Highly Integrated Photonics Connectivity Solutions
Optical Signal Processing for Pluggables and Co-Packaged Optics
Discover advanced silicon photonic integrated circuit (PIC) chips designed for scale-out and scale-up data center infrastructure. Migrate to the power-saving advantage at 1.6T, 3.2T and beyond.
The DSP Optical Module
Laser Integrated PICs simplify volume production and reliability for optics in DSP interconnect scale-out.
DSP Designs
The LPO+™ OSP Advantage
LPO plus optical signal processing (OSP) delivers interoperability for highly efficient all-optical interconnect.
LPO+ Solutions
High Density 3.2T 400G PIC
Compact, highly integrated 3.2T engine optimized for pluggable and high-density NPO architectures.
Get 3.2T 448G
Breakthrough Optical Connectivity for Scale CPO
Our innovative co-packaged optics (CPO) chiplets feature a highly integrated optical engine for energy and bandwidth efficiency in scale-up and scale-out interconnect.
Current Insights from NewPhotonics
Check back here for the most recent news and upcoming event info on NewPhotonics!
Next Gen Scaling in the AI Factory: Introducing the Industry-First 3.2T 400G Transmitter-on-Chip
The AI Factory is no longer a conceptual blueprint; it is the current reality of…
Lightwave Innovation Reviews Honors NPC50503 1.6T NPO Chiplet with OSPic™ All-Optical Signal Processor
We are proud to announce that our breakthrough innovation in highly integrated silicon photonics for…
On The Road to CPO: NPO for High-Demand Bandwidth in Energy-Efficient Interconnect
The race to evolve beyond the electrical limitations of Moore’s Law is on. All attention…
Join The All-Optical Team
Meet the leaders of #TeamNP and join our award winning group of all-optical innovators at the forefront of AI-era interconnect.