All-Optical Photonic ICs Designed for Scale
Highly integrated photonic integrated circuit chips designed for transceiver pluggable and co-packaged optics. Built for energy and bandwidth efficient optical connectivity in the AI-scale data center.
All-Optical Photonic IC Designed for Scale
Highly integrated Photonic IC chip solutions.
Designed for pluggables and co-packaged optics.
Built for energy and bandwidth efficient optical
connectivity in the AI-scale data center.
Optical Signal Processing for Pluggables and Co-Packaged Optics
Discover advanced silicon photonic integrated circuit (PIC) chips designed for scale-out and scale-up data center infrastructure. Migrate to the power-saving advantage at 1.6T, 3.2T and beyond.
The DSP Optical Module
Laser Integrated PICs simplify volume production and reliability for optics in DSP interconnect scale-out.
DSP Designs
The LPO+™ OSP Advantage
LPO plus optical signal processing (OSP) delivers interoperability for highly efficient all-optical interconnect.
LPO+ Solutions
Breakthrough Optical Connectivity for Scale CPO
Our innovative co-packaged optics (CPO) chiplets feature a highly integrated optical engine for energy and bandwidth efficiency in scale-up and scale-out interconnect.
Current Insights from NewPhotonics
Check back here for the most recent news and upcoming event info on NewPhotonics!
Inspiring the Shift to Energy Efficient Photonics Connectivity in Data Center CPO and Pluggables
The industry is increasingly adopting silicon photonics to overcome power and capacity limitations burdened by…
BREAKING NEWS: Centera Announces 1.6T DSP Module with NPG102 Chip
We kicked off year three of NewPhotonics demos at the Optical Fiber Communications conference (OFC50)…
LPO MSA Membership Group Releases Linear Pluggable Optics (LPO) Specification
LPO-MSA Group member NewPhotonics supports specification for 100Gpbs/lane LPO single-mode optical data transmission up to…
Join The All-Optical Team
Meet the leaders of #TeamNP and join our award winning group of all-optical innovators at the forefront of AI-era interconnect.
